Epoxy resin substrate leveling material and adhesive "BO MejiCon #20/#30"
Good adhesion on wet surfaces! It is less prone to sagging and can achieve a maximum thickness of 5mm on vertical surfaces.
"BO MejiCon #20/#30" is an epoxy resin substrate leveling material and adhesive that excels in workability when used with pre-mixed aggregate trowels and spatulas. "BO MejiCon #20" has a low viscosity, making it easy to work with, while "BO MejiCon #30" is flexible and suitable for crack repairs. By using the two types according to the site conditions, excellent workability is achieved. Please feel free to contact us if you have any requests. 【Features】 ■ Excellent workability by using the two types according to site conditions ■ Solvent-free type, ensuring high safety and minimal shrinkage after curing ■ Excellent water resistance and impact resistance *For more details, please download the PDF or feel free to contact us.
- 企業：日塗化学 西日本営業所
- 価格：Other
